Anthony Moreno

Bond Pad Probe Marks Effect on Intermetallic Coverage

Anthony Moreno, Rennier Rodriguez & Frederick Ray Gomez · Journal of Engineering Research and Reports · 2021

The paper presents a study on the effect of semiconductor die’s bond pad probe marks on the interface between the wire and the bond pad. The probe marks are quantified in terms of percentage area in the bond pad, while the interface strength between the wire of Gold material to t...

Open access Research Article 10.9734/jerr/2021/v20i117253

Improvement on QFN Leadframe Design of Extended Leads to Support the Mitigation of Mold Flash Occurrence

Alyssa Grace Gablan, Frederick Ray Gomez & Anthony Moreno · Journal of Engineering Research and Reports · 2021

Parameter optimization is not only the key to find the most favorable and best solution as variable chances of failure modes may happen at extreme case conditions at unexpected period. Packaging design robustness is much resilient to establish a satisfactorily good quality produc...

Open access Research Article 10.9734/jerr/2021/v20i517309