Stencil printing using solder paste material is one of the challenging processes in semiconductor assembly manufacturing. During evaluation of a semiconductor device, off-centered ball issue was encountered. The study aimed to mitigate the off-centered ball issue at stencil pr...
Open access
Research Article10.9734/jerr/2020/v19i317233
The paper focused on the evaluation of quad-flat no-leads single-row (QFN-sr) leadframe package for die shear test performance on different diebond machine platforms. Die shear test determines the adhesion strength on the interface between the silicon die and the die attach glue...
Open access
Research Article10.9734/jerr/2020/v16i317169
In every new technology developed and introduced to the manufacturing floor, particularly in the wafer preparation, entails problems that later induce defects affecting the wafer yield. This paper discusses the optimization of wafer preparation parameters, particularly the tensio...
Open access
Research Article10.9734/jerr/2020/v10i317040
The need of data storage devices and new technologies continues to grow with more robust and stable functioning capability. With that, improvement and utilization never stop for a seamless output. One device that is currently on new product introduction is a quad-flat no-leads (Q...
Open access
Research Article10.9734/jerr/2020/v14i117114
Adhesive film remains on the dicing tape is one of the problems encountered in diebonding or die attach process during the pick-up process of silicon dies. With this occurrence, one method used to identify the root cause is the process mapping from wafer preparation to diebonding...
Open access
Research Article10.9734/jerr/2020/v11i317057
The paper focused in addressing the silicon die chippings defect at the wafer sawing process of an extremely small semiconductor package. In-depth potential risk analysis and Pareto diagram were done to identify the top reject contributors and eventually resolve the issue. A comp...
Open access
Research Article10.9734/jerr/2020/v12i317082
The paper focused on the improvement done in chip on lead (COL) leadframe package assembly manufacturing to address the leadframe bouncing effect during die attach process. A new and enhanced process plate is designed with multi-hole configuration to provide a strong vacuum under...
Open access
Research Article10.9734/jerr/2020/v18i317208