The continuing growth and development on semiconductor package miniaturization have become a particular interest and focus semiconductor industry. The importance of thinner packages also demands a thinner vertical structure of the integrated circuit (IC) design with silicon die o...
Open access
Research Article10.9734/jerr/2020/v14i417129
The paper aimed to mitigate wafer defects such as large kerf shifting issue, dice pop-out occurrence and edge cut defects in the wafer preparation or pre-assembly stage of integrated circuits (IC) assembly manufacturing. With the introduction of new wafer preparation technologies...
Open access
Research Article10.9734/jerr/2020/v12i117071
The semiconductor industry is becoming more inclined to thinner integrated circuit (IC) packages. Thinner packages with thin wafer or die prefer the die attach film (DAF) technology as the die adhesive material solution. As the wafer goes thinner, it becomes more of a challenge i...
Open access
Research Article10.9734/jerr/2020/v10i117029
The paper is focused on the reliability performance of quad-flat no-leads (QFN) package evaluated on different die attach machine platforms. Reliability tests were done to check the difference in the quality and reliability performance of the device that undergone die attach proc...
Open access
Research Article10.9734/jerr/2020/v19i117224
The paper is focused on the glue voids reduction of quad-flat no-leads (QFN) devices evaluated on different die attach machine platforms. The evaluation was narrowed-down into two main die attach machines with the objective of attaining the best performance in terms of reducing o...
Open access
Research Article10.9734/jerr/2020/v15i317144