The development of new technology with thinner and smaller packages has become the movement and focus on semiconductor assembly industry. This paper presents an improvement done in dual-flat no-leads (DFN) package to resolve the quantity of rejection due to die attach film (DAF)...
Open access
Research Article10.9734/jerr/2020/v17i317189
One of the challenging assembly processes in semiconductor manufacturing industry is stencil printing using solder paste as direct material. With this technology, some issues were encountered during the development phase of an advanced leadframe device and one of which is the sol...
Open access
Research Article10.9734/jerr/2020/v16i417176
The paper focused on the evaluation of quad-flat no-leads (QFN) semiconductor package with small silicon die on different machine platforms to achieve a higher bond line thickness (BLT) of greater than 30 µm. The characterization or evaluation was narrowed down into two main dieb...
Open access
Research Article10.9734/jerr/2020/v14i217119
The never-ending trend for package miniaturization has been driving the semiconductor industry to the brink of technology. Hence, development of new technologies is necessary to cope up with the demand for advance and aggressive process capabilities. The paper is all about the ch...
Open access
Research Article10.9734/jerr/2020/v11i417067
The drive for thinner package architecture is already becoming a necessity. There were a need of thinner Integrated Circuit or IC in order to fit in to thinner applications like mobile phones. One of the major semiconductor process that enables miniaturization was wafer back grin...
Open access
Research Article10.9734/jerr/2020/v11i117049
The absent of reliable production controls for Die Attach Film (DAF) voids detection allowed defect escapee for Ball Grid Array (BGA) devices using non-conductive film material leading to gross assembly rejection and customer complaints. This paper presents the evaluation of pres...
Open access
Research Article10.9734/jerr/2020/v10i417047
Wafer Thinning as a major semiconductor process steps to attain miniaturization of Integrated Circuit or IC. Wafer back grinding up to 70 µm thickness is considered critical due to its fragility. The paper will discuss the definition and establishment of critical equipment check...
Open access
Research Article10.9734/jerr/2020/v10i417045
The relentless advancement and trends on thinner packages have become the focus in the semiconductor manufacturing industry. The requirement of thinner packages also demands a thinner vertical structure of the semiconductor electronic design. As a major contributor on the vertica...
Open access
Research Article10.9734/jerr/2020/v10i217037
Wafer passivation or the protective layer of the internal circuitry of the die plays a major role of providing protection and the isolation of electrical stability of the active circuit on the top area of the wafer. Passivation is normally a screen of an oxide layer on the surfac...
Open access
Research Article10.9734/jerr/2019/v6i416958
The continuous development and trends on thinner semiconductor packages have become the focus in the semiconductor industry. The necessity of thinner packages also demands a thinner vertical structure of the integrated circuit (IC) design. As a major contributor on the vertical s...
Open access
Research Article10.9734/jerr/2019/v6i216943
The development on thinner packages has become the trend and focus in semiconductor packaging industry. The necessity of thinner packages also entails a thinner vertical structure of the integrated circuit (IC) design. As a major contributor on the vertical structure of the IC pa...
Open access
Research Article10.9734/jerr/2019/v6i116936
Semiconductor Companies and Industries soar high as the trend for electronic gadgets and devices increases. Transition from “manual” to “fully automatic” application is one of the advantages why consumer adapt to changes and prefer electronic devices as one of daily answers. Indi...
Open access
Research Article10.9734/jerr/2021/v20i717350
Today, semiconductor world is becoming more inclined to thinner Integrated Circuit (IC) packages. IC packages will require thinning of the internal configuration of the package, which involves the die or the wafer and the adhesive material, which is the Die Attach Film (DAF). Ali...
Open access
Research Article10.9734/jerr/2021/v20i717343
Nowadays, semiconductors and electronics are becoming part of our everyday activities. As the Integrated circuits become more useful to people, it also requires more function, which contain more complex and compact components. Aligned to this package requirement, the more challen...
Open access
Research Article10.9734/jerr/2021/v20i517308
Process improvement through modification in the design of indirect material is one potential direction to improve the productivity during assembly manufacturing. In this paper, an augmented design of anvil block is presented to reduce the crumpled strips, leadframe bending and de...
Open access
Research Article10.9734/jerr/2020/v17i217182