The paper focused on the evaluation of quad-flat no-leads (QFN) device in tapeless leadframe technology on different diebonder platforms to achieve an acceptable fillet height performance. The study was narrowed down into two main machines with the objective of attaining a fillet...
Open access
Research Article10.9734/jerr/2021/v20i817353
The paper focused on the improvement done in chip on lead (COL) leadframe package assembly manufacturing to address the leadframe bouncing effect during die attach process. A new and enhanced process plate is designed with multi-hole configuration to provide a strong vacuum under...
Open access
Research Article10.9734/jerr/2020/v18i317208
Adhesive film remains on the dicing tape is one of the problems encountered in diebonding or die attach process during the pick-up process of silicon dies. With this occurrence, one method used to identify the root cause is the process mapping from wafer preparation to diebonding...
Open access
Research Article10.9734/jerr/2020/v11i317057
Improvement on the process and design is often a reliable way to resolve a problem especially in semiconductor industry. This paper presents a leadframe or semiconductor carrier merged with a stand-off design structure that will maintain a consistent bond line thickness (BLT) cri...
Open access
Research Article10.9734/jerr/2020/v11i117051
With the new devices and new technologies in the semiconductor industry are getting more challenging to process because issues are unavoidable especially on thin dies. The paper is focused on the improvement done on a ball grid array (BGA) substrate package assembly to address th...
Open access
Research Article10.9734/jerr/2021/v20i317277
One of the most challenging assembly manufacturing process in semiconductor industry is wirebond process using a wire as direct material. With this new technology, some issues were encountered during the first trial of a quad flat no-leads (QFN) package. This paper is focused on...
Open access
Research Article10.9734/jerr/2020/v19i217228
New devices and new technologies in semiconductor industry are getting more complex in terms of package layout, direct materials, and process capability. With the package design complexity, several issues are encountered during the development, and in turn affecting the overall...
Open access
Research Article10.9734/jerr/2020/v11i217059
With the continuous trend of new technologies in semiconductor manufacturing assembly, challenges and issues are unavoidable. This paper presents the modification and improvement done on the process plate design to eliminate the bouncing effect of the silicon die that leads to of...
Open access
Research Article10.9734/jerr/2021/v20i717340
Stencil printing using solder paste material is one of the challenging processes in semiconductor assembly manufacturing. During evaluation of a semiconductor device, off-centered ball issue was encountered. The study aimed to mitigate the off-centered ball issue at stencil pr...
Open access
Research Article10.9734/jerr/2020/v19i317233
During new product development of a substrate land grid array (LGA) device, issues were encountered at wirebonding process due to design constraints. This paper is focused on addressing the wire-to-wire short defect during wirebonding process of the first bond. Wirebond process o...
Open access
Research Article10.9734/jerr/2021/v20i417297
The paper focused on the evaluation of quad-flat no-leads single-row (QFN-sr) leadframe package for die shear test performance on different diebond machine platforms. Die shear test determines the adhesion strength on the interface between the silicon die and the die attach glue...
Open access
Research Article10.9734/jerr/2020/v16i317169
The need of data storage devices and new technologies continues to grow with more robust and stable functioning capability. With that, improvement and utilization never stop for a seamless output. One device that is currently on new product introduction is a quad-flat no-leads (Q...
Open access
Research Article10.9734/jerr/2020/v14i117114