Die Crack Resolution through Pick-up Process Optimization for BGA Package
R. Rodriguez, E. Graycochea Jr., F. R. Gomez & E. Manalo · Journal of Engineering Research and Reports · 2021
With the new devices and new technologies in the semiconductor industry are getting more challenging to process because issues are unavoidable especially on thin dies. The paper is focused on the improvement done on a ball grid array (BGA) substrate package assembly to address th...
Open access
Research Article
10.9734/jerr/2021/v20i317277