Critical Insights in the Application of Convection and Pressure Curing in Eliminating DAF Voids
Bryan Christian S. Bacquian, Rennier Rodriguez & Edwin M. Graycochea · Journal of Engineering Research and Reports · 2020
The absent of reliable production controls for Die Attach Film (DAF) voids detection allowed defect escapee for Ball Grid Array (BGA) devices using non-conductive film material leading to gross assembly rejection and customer complaints. This paper presents the evaluation of pres...
Open access
Research Article
10.9734/jerr/2020/v10i417047