Wirebond Process Improvement through Silicon Die Polyimide Removal
Anthony R. Moreno, Jonalyn E. Jaylo, Frederick Ray I. Gomez & Edwin M. . Graycochea Jr · Journal of Engineering Research and Reports · 2020
This study aims to develop polyimide etching process on the silicon die after decapsulation to resolve the wire shear issue during ball shear data gatherings. The shear strength of the ball is affected by the presence of polyimide insulator during ball shearing process, due to th...
Open access
Research Article
10.9734/jerr/2020/v12i117073