Edwin M. Graycochea Jr

Die Attach Process Optimization with Enhanced Epoxy Control on Leadframe Package

Rennier S. Rodriguez, Edwin M. Graycochea Jr, Rammil A. Seguido & Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2020

The paper presents a practical procedure in selecting the best candidate for die attach epoxy control or anti-epoxy bleed-out (anti-EBO) concentration during the introduction of new leadframe configuration. Three different criteria were implemented to measure the relative impact...

Open access Research Article 10.9734/jerr/2020/v14i217121

Bond Line Thickness Characterization for QFN Package Robustness

Bryan Christian S. Bacquian, Edwin M. Graycochea Jr, Frederick Ray I. Gomez & Rennier S. Rodriguez · Journal of Engineering Research and Reports · 2020

The paper focused on the evaluation of quad-flat no-leads (QFN) semiconductor package with small silicon die on different machine platforms to achieve a higher bond line thickness (BLT) of greater than 30 µm. The characterization or evaluation was narrowed down into two main dieb...

Open access Research Article 10.9734/jerr/2020/v14i217119