Ernani D. Padilla

Compound Handling Automation: An Error Proof Solution in Eliminating Mold Misprocessing

Ernani D. Padilla & Emmanuel P. Birog · Journal of Engineering Research and Reports · 2020

This paper aims to identify and eliminate the weaknesses of the epoxy mold compound (EMC) thawing process that contributes to mold misprocessing occurrence such as wrong mold compound, under thawed or expired mold compound. Creation of automation solutions addressing high risk ar...

Open access Research Article 10.9734/jerr/2020/v17i417194

Enabling Artificial Intelligence as Input Variable Control to Prevent Package Thickness Related Defect in Compression Molding

Ernani D. Padilla & Emmanuel P. Birog · Journal of Engineering Research and Reports · 2020

This paper aims to identify the causes of package thickness related defects in compression mold process. Related defects include wrong package thickness, exposed wire and/or die and mold bleed out. There are three scenarios why package thickness problem is encountered in compress...

Open access Research Article 10.9734/jerr/2020/v16i117155