Die Attach Process Analysis of Enhanced Stand-off Stopper on Tapeless Leadframe
E. Graycochea Jr., F. Gomez, R. Rodriguez & B. Bacquian · Journal of Engineering Research and Reports · 2020
Improvement on the process and design is often a reliable way to resolve a problem especially in semiconductor industry. This paper presents a leadframe or semiconductor carrier merged with a stand-off design structure that will maintain a consistent bond line thickness (BLT) cri...
Open access
Research Article
10.9734/jerr/2020/v11i117051