Material Selection for Heat Sinks in HPC Microchip-Based Circuitries
Kunle Joseph Akinluwade, F. O. Omole, D. A. Isadare, O. S. Adesina & A. R. Adetunji · Current Journal of Applied Science and Technology · 2015
Heat sinks are integral components of high-powered computing system (HPC) microchips which are extensively used in modern electronics and power supply circuitries with intelligence and effective control capability. Integrated circuits typically generate large amount of heat suffi...
Open access
Research Article
10.9734/BJAST/2015/15214