With the continuous trend of new technologies in semiconductor manufacturing assembly, challenges and issues are unavoidable. This paper presents the modification and improvement done on the process plate design to eliminate the bouncing effect of the silicon die that leads to of...
Open access
Research Article10.9734/jerr/2021/v20i717340
During new product development of a substrate land grid array (LGA) device, issues were encountered at wirebonding process due to design constraints. This paper is focused on addressing the wire-to-wire short defect during wirebonding process of the first bond. Wirebond process o...
Open access
Research Article10.9734/jerr/2021/v20i417297
This paper presents the application of an innovative design of wirebond process plate during wirebonding process of thin semiconductor carrier such as the pre-encapsulated leadframe. The implementation of the specialized process plate aims to improve the conventional method of wi...
Open access
Research Article10.9734/jerr/2020/v16i217162