Elimination of Intermetallic Coverage Over-etching on Aluminum Pad
Jonalyn Jaylo-Sia, Jonathan Pulido & Frederick Ray Gomez · Journal of Engineering Research and Reports · 2021
Intermetallic coverage (IMC) is one of the critical wirebond output responses that is usually checked to ensure the ball to pad integrity. The success of wirebonding relies on the formation of an interfacial intermetallic growth of ball bond to ensure it can withstand reliability...
Open access
Research Article
10.9734/jerr/2021/v20i717351