Substrate Design Augmentation for Die Placement Reference at Die Attach Process
Rennier Rodriguez, Jr. Edwin Graycochea & Frederick Ray Gomez · Journal of Engineering Research and Reports · 2021
Die placement reference in die attach process is one of the critical aspects in measuring the actual die placement especially for the device that has a required measurement. This paper focused on the re-design on the layout of the substrate ball grid array (BGA) package with cros...
Open access
Research Article
10.9734/jerr/2021/v20i817355