A Robust Approach of Maintaining Epoxy Position on Die Attach Process of Tapeless QFN Packages
Jerome J. Dinglasan, Leandro D. Saria & Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2021
Epoxy quality contributes a great role in defining quality products of quad flat no lead multi row packages. In dealing with certain problems related to epoxy position shift caused by unoptimized design, innovation on the dispenser module is considered and focused at. This paper...
Open access
Research Article
10.9734/jerr/2021/v20i617333