Semiconductor Package Design Solution for Addressing High-Density Configuration
Rennier Rodriguez, Frederick Ray Gomez & Maiden Grace Maming · Journal of Engineering Research and Reports · 2020
The direction for integrated circuit (IC) packaging is getting smaller yet with increasing unit performance. In this case substrate-based technology became limited to miniaturization and downsizing direction. In this paper, a specialized design of IC is presented and discussed th...
Open access
Research Article
10.9734/jerr/2020/v16i317166