Enhanced Die Attach Process Defect Recognition on QFN Leadframe Packages
Marque Ryan Salcedo, Alyssa Grace Gablan, Jerome Dinglasan & Frederick Ray Gomez · Journal of Engineering Research and Reports · 2021
Advanced packaging at the back-end semiconductor manufacturing characterizes various equipment capabilities per device requirement. High resolution imaging for inspection system during die attach process has gained its interest to feature automated selections during in-line proce...
Open access
Research Article
10.9734/jerr/2021/v20i317286