The Open time is called the time it takes for this chemical transition from liquid to solid. The epoxy moves into a gel state from the liquid state as it recovers, until it enters a solid-state. This article will address the development of a new, regulatory-compliant in die attac...
Open access
Research Article10.9734/jerr/2021/v20i317280
This research paper addressed how to improve the Die Attach Pneumatic Time-Pressure Dispensing Valve. Different assessment and statistical validation comparing the efficiency of the Pneumatic Time-Pressure Dispensing Valve and Dispensing Volume Reduction. The Musashi Super Ʃ CMII...
Open access
Research Article10.9734/jerr/2021/v20i117257
One of the problems facing the Die Attach engineers at Front of Line is the lack of control of their Die Attach Recipes. Currently, all Recipes are stored on a computer that is accessed by all users and transferred to the Die Attach machine using a diskette via a simple file copy...
Open access
Research Article10.9734/jerr/2021/v20i117255
Excessive epoxy flow on the dispensing nozzle may result in epoxy tailings due to unoptimized dispensing parameters. This may cause various problems related to epoxy dispensing, such as epoxy splatter, epoxy on lead, and epoxy bridging. This research study is conducted to elimin...
Open access
Research Article10.9734/jerr/2021/v20i117242
In the Semiconductor Industry, the delamination performance of integrated circuit packaging is being aggressively improved. However, this task is complicated and difficult, as the defective failure is highly dependent on the compatibility of the material characteristics that may...
Open access
Research Article10.9734/jerr/2020/v19i417236
Driven by the company vision to become a high-volume manufacturing (HVM), increasing throughput in the manufacturing line is critical to meeting market demands. The ever-growing demand for integrated circuits in part requires additional capital investment to purchase new equipmen...
Open access
Research Article10.9734/jerr/2020/v18i117201
Die attach epoxy dispensing is an automated factory environment that creates some special challenges. A robust production process begins with an understanding of the adhesives in their fluid state and which important parameters must be controlled. One of the most common problems...
Open access
Research Article10.9734/jerr/2020/v17i417196
The paper discussed the study and challenges of the Die Attach process, the critical characteristics of the product structure and the demand for the MEMS product. Upgrading the current machine mechanical and software to improve the machine's capabilities and overcome the critical...
Open access
Research Article10.9734/jerr/2020/v17i117178
Poor die adhesion to substrate resulting to stray dice issue for the MEMS package was encountered. This die bond failure mechanism has a downstream effect specifically on the mold process. The presence of the stray die resulted to mold compound leakage outside the tool cavity due...
Open access
Research Article10.9734/jerr/2020/v16i317171
This paper studies the challenges and behavior of epoxy material between the roughened Leadframe during the Die Attach process. Die bond on the roughened die-attach paddle (DAP) of epoxy has been a challenge for its manufacturability in terms of maintaining the target epoxy volum...
Open access
Research Article10.9734/jerr/2020/v16i117158