The paper focused on the evaluation of quad-flat no-leads single-row (QFN-sr) leadframe package for die shear test performance on different diebond machine platforms. Die shear test determines the adhesion strength on the interface between the silicon die and the die attach glue...
Open access
Research Article10.9734/jerr/2020/v16i317169
The paper focused in addressing wire-related assembly issues due to tight clearances in the semiconductor package design. Package design characterization was done considering the assembly design rules and the advanced rules, resulting to the integration of an interposer in the pa...
Open access
Research Article10.9734/jerr/2020/v11i217054
Stencil printing using solder paste material is one of the challenging processes in semiconductor assembly manufacturing. During evaluation of a semiconductor device, off-centered ball issue was encountered. The study aimed to mitigate the off-centered ball issue at stencil pr...
Open access
Research Article10.9734/jerr/2020/v19i317233