ESD Diode Protection Incorporated on Leadframe Package
Frederick Ray I. Gomez, Edwin M. Graycochea Jr., Nerie R. Gomez & Rennier S. Rodriguez · Journal of Engineering Research and Reports · 2020
With the new die technology becomes smaller and thinner, silicon die circuit metallization also becomes smaller, thus electronic devices like quad-flat no-leads multi-row (QFN-mr) semiconductor leadframe package design become more sensitive and prone to electrostatic discharge (E...
Open access
Research Article
10.9734/jerr/2020/v14i317126