RSOB Shorting Defect Resolution through Looping Optimization and Ball Placement at Wirebond Process
Norman S. Calma, Jonathan C. Pulido & Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2021
Wirebonding process is one of the most challenging assembly manufacturing process in semiconductor packaging industry. This paper discussed the wirebonding challenge and the solution to resolve the wire to die shorting on reverse stitch on ball (RSOB) and prevent irregular loopin...
Open access
Research Article
10.9734/jerr/2021/v20i1017387