Expanded Usage Window of Molding Compound to Reduce Material Wastage in Manufacturing Line
Roland Soriano, Lester Joseph T. Belalo & Rey Nino C. Arnido · Journal of Engineering Research and Reports · 2021
This paper discusses about direct material wastage brought by expiring molding compound particularly for QFN-mr Packages. An Engineering problem solving methodology was used to identify the material, its consumption, cost, the root cause, and solution of the problem. The study ai...
Open access
Research Article
10.9734/jerr/2021/v20i217266