MEMS Technology: A Review

References (72)

1. 1 Silicon as a mechanical material [DOI]
2. 2 Piezoresistance Effect in Germanium and Silicon [DOI]
3. 3 SU-8: a low-cost negative resist for MEMS [DOI]
4. 4 An Introduction to Microelectromechanical Systems Engineering [DOI]
5. 5 Silicon VLSI Technology: Fundamentals, Practice and Modeling
6. 6 Ultra-wide bandwidth piezoelectric energy harvesting [DOI]
7. 7 Recent Advances in Application of Biosensors in Tissue Engineering [DOI]
8. 8 Silicon nitride single-layer x-ray mask [DOI]
9. 9 SCREAM I: A single mask, single-crystal silicon, reactive ion etching process for microelectromechanical structures [DOI]
10. 10 VLSI fabrication principles : silicon and gallium arsenide
11. 11 LPCVD silicon-rich silicon nitride films for applications in micromechanics, studied with statistical experimental design* [DOI]
12. 12 Fracture toughness of polysilicon MEMS devices [DOI]
13. 13 Atomic layer deposited protective coatings for micro-electromechanical systems [DOI]
14. 14 Thermophysical properties of low-residual stress, Silicon-rich, LPCVD silicon nitride films [DOI]
15. 15 Three-dimensional micro electromechanical system piezoelectric ultrasound transducer [DOI]
16. 16 Mechanical characterization of thick polysilicon films: Young's modulus and fracture strength evaluated with microstructures [DOI]
17. 17 Design optimization of a piezoresistive pressure sensor considering the output signal-to-noise ratio [DOI]
18. 18 Digital light processing and MEMS : timely convergence for a bright future
19. 19 Sputtered silicon carbide thin films as protective coating for MEMS applications [DOI]
20. 20 Simulation and fabrication of piezoresistive membrane type MEMS strain sensors [DOI]
21. 21 A low-temperature CVD process for silicon carbide MEMS [DOI]
22. 22 Materials reliability in MEMS devices [DOI]
23. 23 Materials selection in micromechanical design: an application of the ashby approach [DOI]
24. 24 Post-CMOS integration of germanium microstructures [DOI]
25. 25 Measurements of residual stresses in thin films using micro-rotating-structures [DOI]
26. 26 Poly SiGe, a promising material for MEMS monolithic integration with the driving electronics [DOI]
27. 27 The fabrication of nonplanar spin-on glass microstructures [DOI]
28. 28 Germanium as a versatile material for low-temperature micromachining [DOI]
29. 29 Comparative study on chemical stability of dielectric oxide films under HF wet and vapor etching for radiofrequency microelectromechanical system application [DOI]
30. 30 Characterization of polycrystalline silicon carbide films grown by atmospheric pressure chemical vapor deposition on polycrystalline silicon [DOI]
31. 31 Monolithic ultrasonic integrated circuits based on micromachined semi-ellipsoidal piezoelectric domes [DOI]
32. 32 Development of a MEMS testing methodology [DOI]
33. 33 Polycrystalline silicon for integrated circuits and displays (2nd ed.)
34. 34 Integration of sputtered silicon microstructures with pre-fabricated CMOS circuitry [DOI]
35. 35 Routes to failure in rotating MEMS devices experiencing sliding friction [DOI]
36. 36 Bipolar-compatible epitaxial poly for smart sensors: stress minimization and applications [DOI]
37. 37 Stress control of a-SiC films deposited by dual source dc magnetron sputtering [DOI]
38. 38 Challenges of Complete CMOS/MEMS Systems Integration [DOI]
39. 39 Advantages of MEMS and its Distinct New Applications [DOI]
40. 40 Design and Development of MEMS Pressure Sensor Characterization Setup with Low Interfacing Noise by Using NI-PXI System [DOI]
41. 41 Low strain sputtered polysilicon for micromechanical structures [DOI]
42. 42 Silicon nitride membrane sensors with monocrystalline transducers [DOI]
43. 43 Single-crystal SiC thin-film produced by epitaxial growth and its application to micro-mechanical devices [DOI]
44. 44 Deposition and Characterization of In-Situ Boron Doped Polycrystalline Silicon Films for Microelectromechanical Systems Applications [DOI]
45. 45 Shrinking of Spin-On-Glass Films Induced by Synchrotron Radiation and Its Application to Three-Dimensional Microfabrications [DOI]
46. 46 Testing requirements for microelectromechanical systems (MEMS) [DOI]
47. 47 Challenges in MEMS Technology [DOI]
48. 48 An Overview of MEMS Testing Technologies [DOI]
49. 49 The Challenge of MEMS Test
50. 50 Introduction and Fundamentals [DOI]
51. 51 Fundamentals of Microfabrication [DOI]
52. 52 Microsystem Design [DOI]
53. 53 Micromachined inertial sensors [DOI]
54. 54 A gas chromatographic air analyzer fabricated on a silicon wafer [DOI]
55. 55 The resonant gate transistor [DOI]
56. 56 Surface micromachining for microelectromechanical systems [DOI]
57. 57 Silicon carbide MEMS for harsh environments [DOI]
58. 58 High-Temperature Single-Crystal 3C-SiC Capacitive Pressure Sensor [DOI]
59. 59 Nanopore Technology for Biomedical Applications [DOI]
60. 60 Fabrication and Characterization of a CMOS-MEMS Humidity Sensor [DOI]
61. 61 deformable grating optical modulator
62. 62 Top-emitting micromechanical VCSEL with a 31.6-nm tuning range [DOI]
63. 63 Measurement of Young's modulus on microfabricated structures using a surface profiler [DOI]
64. 64 Review on Break through MEMS Technology
65. 65 Failure modes in surface micromachined microelectromechanical actuators [DOI]
66. 66 A Systematic Approach to Process Selection in MEMS [DOI]
67. 67 Post-CMOS Modular Integration of Poly-SiGe Microstructures using Poly-Ge Sacrificial Layers [DOI]
68. 68 Fabrication of submicron high-aspect-ratio GaAs actuators [DOI]
69. 69 Reliability and long term stability of MEMS [DOI]
70. 70 Microsystems Testing: an Approach and Open Problems
71. 71 Performance of GaAs microbridge thermocouple infrared detectors [DOI]
72. 72 Microsystem Testing: Challenge Or Common Knowledge [DOI]

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