Pick and Place Process Defect Mitigation on Semiconductor BGA Device
Antonio R. Sumagpang Jr., Frederick Ray I. Gomez, Edwin M. Graycochea Jr.
Journal of Engineering Research and Reports · pp. 1–5 · Published 7 Oct 2020
10.9734/jerr/2020/v17i317187Abstract
With the new devices and new technologies in semiconductor industry are getting more challenging to process because of new processes and process bricks. One of the most challenging assembly processes is the pick and place or the die attach process. Issues were encountered during product development phase of a semiconductor ball grid array (BGA) device of radio frequency (RF) applications and one of which is the “thrown” dies during die picking. This paper is focused on addressing the thrown dies issue at pick and place process. Installation of blower ionizer on the machine is an extensive improvement done to eliminate the foreign materials resulting to thrown dies during picking. With this improvement, a reduction of around 80 percent of thrown dies was achieved. For future works, the improvement and learnings could be used for devices with similar requirement.
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