The paper discussed the study and challenges of the Die Attach process, the critical characteristics of the product structure and the demand for the MEMS product. Upgrading the current machine mechanical and software to improve the machine's capabilities and overcome the critical...
Open access
Research Article10.9734/jerr/2020/v17i117178
One of the challenging assembly processes in semiconductor manufacturing industry is stencil printing using solder paste as direct material. With this technology, some issues were encountered during the development phase of an advanced leadframe device and one of which is the sol...
Open access
Research Article10.9734/jerr/2020/v16i417176
This study shows how to monitor the movement of cattle using wireless sensor nodes powered by a renewable energy source capable of detecting location. Performance analysis was carried out on the energy consumption pattern of the nodes which indicated that throughout the monitorin...
Open access
Research Article10.9734/jerr/2020/v17i117177
A light fluid from different reservoir formation started recently to associate the production of the crude oil stabilization plant which is unfortunately not enough to release off all light components and as a results the true vapor pressure increased in the storage tanks more th...
Open access
Research Article10.9734/jerr/2020/v16i417174
A digital soil moisture reader was constructed and tested. It uses a lipo battery of 9v which was regulated to a constant 5v with the help of a voltage regulator 7805. The digital soil moisture reader developed was tested and the result obtained was compared with that obtained us...
Open access
Research Article10.9734/jerr/2020/v16i417175
The gradually exhausting crude oil reserves worldwide have made experts in the building industry to explore alternative resources for road construction materials. This study was designed to evaluate the potential applications of engine oil wastes as a bitumen modifier. The Waste...
Open access
Research Article10.9734/jerr/2020/v16i417173
The paper focused in addressing the package voids defect of a semiconductor device utilizing an extremely small leadframe technology. Potential risk analysis and pareto diagram were completed to identify the top reject contributors and eventually come-up with the robust solution....
Open access
Research Article10.9734/jerr/2020/v16i417172
Poor die adhesion to substrate resulting to stray dice issue for the MEMS package was encountered. This die bond failure mechanism has a downstream effect specifically on the mold process. The presence of the stray die resulted to mold compound leakage outside the tool cavity due...
Open access
Research Article10.9734/jerr/2020/v16i317171
Optimal performance of the Brushless Direct Current (BLDC) motor is to be realized using an efficient Proportional Integral Derivative (PID) controller. However, conventional tuning technique fails to perform satisfactorily under parameter variations, nonlinear conditions and tim...
Open access
Research Article10.9734/jerr/2020/v16i317170
The paper focused on the resolution of damaged metallization during assembly process that lead to gross open-short (O/S) rejections during functional testing of a highly complex semiconductor package. Numerous batches were put on hold due to not meeting the specification assigned...
Open access
Research Article10.9734/jerr/2020/v16i317167
Aims: The variations in production performances of the Black oil and compositional simulation models can be evaluated by simulating oil formation volume factor (Bo), gas formation volume factor (Bg), gas-oil ratio (Rs) and volatilized oil-gas ratio (Rv). The accuracy of these two...
Open access
Research Article10.9734/jerr/2020/v16i317168
The paper focused on the evaluation of quad-flat no-leads single-row (QFN-sr) leadframe package for die shear test performance on different diebond machine platforms. Die shear test determines the adhesion strength on the interface between the silicon die and the die attach glue...
Open access
Research Article10.9734/jerr/2020/v16i317169
The direction for integrated circuit (IC) packaging is getting smaller yet with increasing unit performance. In this case substrate-based technology became limited to miniaturization and downsizing direction. In this paper, a specialized design of IC is presented and discussed th...
Open access
Research Article10.9734/jerr/2020/v16i317166
This paper presents an experimental analysis of heat transfer using different shaped fills in a counter flow induced draft cooling tower. The main objective is to determine and compare the characteristics of the cooling tower using newly shaped (splash and film) fills and the reg...
Open access
Research Article10.9734/jerr/2020/v16i217165
This paper presents the application of an innovative design of wirebond process plate during wirebonding process of thin semiconductor carrier such as the pre-encapsulated leadframe. The implementation of the specialized process plate aims to improve the conventional method of wi...
Open access
Research Article10.9734/jerr/2020/v16i217162