The wireless fluid level indicator comprises a sensing and transmitting circuit for detecting and transmitting the levels of fluids from a container to the receiving circuit which receives and displays the amount of the measured volume. This has been achieved using an ultrasonic...
Open access
Research Article10.9734/jerr/2020/v14i117116
In the present research study, modal and harmonic response analysis is performed for a stepped shaft made of SS-304 material using the FEM simulation technique. In the present study crack effect is also considered to find the role of cracks during modal analysis. Total six mode s...
Open access
Research Article10.9734/jerr/2020/v14i117112
The construction industry is characterized by low productivity with low technological advances, minimum automation and computerization. Building Information Modeling (BIM) as a means of technological innovation, has the great potentials to improve productivity, decrease project c...
Open access
Research Article10.9734/jerr/2020/v14i117113
The need of data storage devices and new technologies continues to grow with more robust and stable functioning capability. With that, improvement and utilization never stop for a seamless output. One device that is currently on new product introduction is a quad-flat no-leads (Q...
Open access
Research Article10.9734/jerr/2020/v14i117114
Noise has an environmental challenge is increasing due to urbanization, industrialization and modernization. While residential noise pollution could have adverse effect on health and social wellbeing, little attention has been directed towards investigating the implications of sp...
Open access
Research Article10.9734/jerr/2020/v12i417089
Near fault earthquake record are rich in high frequencies that effects structures for far fault earthquake record lower frequencies is not effects highly in structure. The objective of the study is to be investigating the effect of near-fault and far fault earthquake motion on th...
Open access
Research Article10.9734/jerr/2020/v12i417087
In integrated circuit (IC) manufacturing industry, package micro-crack and other crack-related flaws are common defect frequently encountered in trim and form process of a surface mount IC package. This paper focused on the prevention of the micro-crack occurrence as it affected...
Open access
Research Article10.9734/jerr/2020/v12i417086
The intelligent sports analysis of a soccer ball requires accurately simulating its motion and finding the best design parameters (position and orientation) to kick the ball. An optimization method is proposed to plan, evaluate, and optimize the traveling trajectory of a soccer...
Open access
Research Article10.9734/jerr/2020/v12i417085
Wirebonding process is one important assembly process responsible for providing electrical connections between the silicon die and the external leads of a semiconductor package or device. The process also brings along some challenges as the device becomes more complex and critica...
Open access
Research Article10.9734/jerr/2020/v12i417084
Refuse dumpsites are found scattered within and outside cities in Nigeria and the open burning of these dumps is a common practice mainly as a waste and odour reduction measure. Open incineration of wastes emits dangerous gases into the atmosphere. The environmental and public he...
Open access
Research Article10.9734/jerr/2020/v12i317083
The paper focused in addressing the silicon die chippings defect at the wafer sawing process of an extremely small semiconductor package. In-depth potential risk analysis and Pareto diagram were done to identify the top reject contributors and eventually resolve the issue. A comp...
Open access
Research Article10.9734/jerr/2020/v12i317082
Aim: The study aimed at utilizing finite element modeling approach for extrapolation of BOD5 along the longitudinal length of the stream. Study Design: The linear element method was used for analyzing the Biological Oxygen Demand (BOD) transport along the longitudinal length of t...
Open access
Research Article10.9734/jerr/2020/v12i317081
With new and continuous semiconductor technology trends, challenges in assembly manufacturing are inevitable. This paper focused on the elimination of assembly defects particularly package chip-out and scratch at the singulation end-of-line (EOL) process of a semiconductor device...
Open access
Research Article10.9734/jerr/2020/v12i317079
The inhibitive ability of pawpaw, neem and curry leaf extracts on corrosion of mild steel in sulfuric acid solution were investigated in this work. The extracts obtained from their respective leaves, were characterized to determine their phytochemical constituents as well as func...
Open access
Research Article10.9734/jerr/2020/v12i317080
A non-destructive way to determine the ripeness of watermelon is very difficult, by outward characteristics such as size or external colour and used methods include different limitations. In this study a simple and intelligent method to determine the ripeness of watermelon was de...
Open access
Research Article10.9734/jerr/2020/v12i217077