In the semiconductor manufacturing industry, package chip-out is a common defect frequently encountered in trim and form (T/F) process. For thin shrink small outline package (TSSOP), top defect incurred during assembly manufacturing was the package chip-out located at the top su...
Open access
Research Article10.9734/jerr/2019/v5i216922
The technical paper showcased a comprehensive study on laser (light amplification by stimulated emission of radiation) grooving as breakthrough and ultimate solution in wafer sawing. The project is intended to address various defects such as chippings, metal dangling/peel off, cr...
Open access
Research Article10.9734/jerr/2018/v3i416881
This technical paper discusses a methodological and systematic way of resolving key challenges during introduction of Chip-On-Lead package specifically wirebonding issues that leads to production dilemma during production ramp-up of products using copper wire in tapeless leadfram...
Open access
Research Article10.9734/jerr/2018/v3i216869
The technical paper presents a systematic and methodological approach to deal with a new product trend that will be successfully manufactured during assembly production ramp-up. The project is intended to determine the required process flow and machine platforms for high-density...
Open access
Research Article10.9734/jerr/2018/v3i116867