Introduction of Laser Grooving Technology for Wafer Saw Defects Elimination

Abstract

The technical paper showcased a comprehensive study on laser (light amplification by stimulated emission of radiation) grooving as breakthrough and ultimate solution in wafer sawing. The project is intended to address various defects such as chippings, metal dangling/peel off, cracks, and other wafer-related defects induced during wafer sawing process. Series of process simulations, actual processing, benchmarking, and collaborations with suppliers are carried out to attain a zero defect in wafer sawing. Critical processes and controls on this new technology are shown and how the mentioned defects are properly addressed. The laser grooving is the newest and latest developed state-of-the-art technology over conventional mechanical sawing using blades. Sawing process is considered as one of the challenges in the plant as it deals with different wafer technologies. Different blade types also need to be properly maintained. Compared to the conventional and universal mechanical sawing using blades, complex errors and top reject contributor of identified critical processes are corrected and required process capability index is achieved.