Addressing the Broken Wire Issue during the Assembly Manufacturing of QFN Leadframe Device
Raymond Albert A. Narvadez, Freddie B. Folio, Frederick Ray I. Gomez & Jonathan C. Pulido · Journal of Engineering Research and Reports · 2021
The integrity of the assembly wirebond process’ 2nd bond poses a big challenge for semiconductor manufacturing of quad-flat no-leads (QFN) devices, particularly on multiple wires on a lead. These devices are vulnerable to induce or obtain broken wire at heel defect. This type of...
Open access
Research Article
10.9734/jerr/2021/v20i817363