The integrity of the assembly wirebond process’ 2nd bond poses a big challenge for semiconductor manufacturing of quad-flat no-leads (QFN) devices, particularly on multiple wires on a lead. These devices are vulnerable to induce or obtain broken wire at heel defect. This type of...
Open access
Research Article10.9734/jerr/2021/v20i817363
After singulation process where the strips are being cut into single units, unit tray loading comes next. Unit tray loading is the process where the singulated units will be picked up from the table and then place it in a tray pocket. Z-picker assembly executes the pick and placi...
Open access
Research Article10.9734/jerr/2021/v20i817364
A comparative study of three drying methods of baobab leaves have been conducted and reported. Mixed mode solar drying, indirect mode solar drying and open sun drying of baobab leaves were conducted based on three drying models viz a viz Lewis,. Page and Henderson and Pabis model...
Open access
Research Article10.9734/jerr/2021/v20i817361
The need for a simpler, effective and less expensive predictive tool for the estimation of natural gas compressibility factor cannot be exaggerated. An accurate prediction of gas compressibility factor is essential because it plays a definitive role in evaluating gas reservoir pr...
Open access
Research Article10.9734/jerr/2021/v20i817360
Weeds are unwanted and undesirable plant that interfere with the utilization of land and water resources and adversely affect crop production. After preliminary study, it was found out that power tiller could be adopted for weeding. Therefore, the study aimed at improving its per...
Open access
Research Article10.9734/jerr/2021/v20i817359
Breakthroughs and innovations are constantly being developed in electronic packaging industry to address the manufacturing challenges and overcome existing assembly limitations. An augmented design of thin Silicon die is introduced to establish a robust and improved interface adh...
Open access
Research Article10.9734/jerr/2021/v20i817358
Theta rotation on die during diebond process is one of the critical machine responses especially for land grid array (LGA) device with tight tolerances requirement. The paper focuses on the die theta rotation tolerance capability with critical design for LGA device evaluated on t...
Open access
Research Article10.9734/jerr/2021/v20i817357
Silicon wafer as a direct material is one of the vital parts of a semiconductor product. Wastages on manufacturing plants that pulls the yield down should be addressed innovatively and accurately. This paper focused on the phenomenon of broken wafers at wafer taping process durin...
Open access
Research Article10.9734/jerr/2021/v20i817356
Die placement reference in die attach process is one of the critical aspects in measuring the actual die placement especially for the device that has a required measurement. This paper focused on the re-design on the layout of the substrate ball grid array (BGA) package with cros...
Open access
Research Article10.9734/jerr/2021/v20i817355
This paper addresses two important useful extensions of binary reliability techniques to multi-state reliability techniques, namely: (a) the problem of complementation or inversion of the function of system success to that of system failure (or equivalently, of deriving the logic...
Open access
Research Article10.9734/jerr/2021/v20i817354