Effect of Morphological Structure, Temperature and Solvent on the Association Behavior of Some Copper Salts- Conductometric Study

Abstract

The purpose of this study is the investigation of the effect of morphological structure, temperature and solvent on the association thermodynamic of some copper salts using conductometric measurements. The conductivity data have been analyzed by Shedlowsky equation to determine ion–pair association constant (Ka) of bulk and nanoparticles solutions of CuSO4 and Cu (CH3COO)2 in water and in 30% (by volume) ethanol-water at 298.15 K and 308.15 K. The results show that the equivalent and limiting equivalent conductance are increase as the temperature increase and decrease as the % of ethanol increase. The ion–pair association constant was found to increase as the % of ethanol increase and decrease as the temperature increase.  Also, the results indicate that the equivalent and limiting equivalent conductance for nano both CuSO4 are higher than that of bulk one while for nano Cu (CH3COO)2 is lower than that of bulk one. The free energy change of the association process was also calculated and the association process of the salts under study was a spontaneous one. No triple ion association took place. The activation energy of the association process of the salts under study was also calculated and discussed.