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Research Article Open access CC BY 4.0

Conceptualized Improvement on Transparent Glass Die for a Robust Manufacturing Process

Jerome J. Dinglasan, Frederick Ray I. Gomez, Alyssa Grace S. Gablan

Journal of Engineering Research and Reports · pp. 52–56 · Published 7 May 2021

10.9734/jerr/2021/v20i617326

Abstract

Glass die are one of the materials used by semiconductor plants during production of specialized quad-flat no-leads (QFN) products. With its transparent appearance and fragile characteristics, several challenges are encountered and analyzed to resolve unwanted issues and to have a robust process manufacturing. This paper will discuss a potential concept of process improvement on the side of the device’s manufacturing with pattern recognition capability as detection and identification of the material to be processed. The paper will also discuss different options that can be selectively considered with respect to the manufacturer’s capability of their process flow.

Glass attaches process glass die pattern recognition system QFN

References (6)

  1. 1 Dicing die attach challenges at multi die stack packages [DOI]
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  4. 4 Enhanced Die Attach Process Defect Recognition on QFN Leadframe Packages [DOI]
  5. 5 Enhanced Wirebonding Technique on QFN Device with Critical Die Reference [DOI]
  6. 6 Autonomous on-wafer sensors for process modeling, diagnosis, and control [DOI]

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