Modified Sidewall Design of QFN Package
Frederick Ray I. Gomez, Rennier S. Rodriguez
Journal of Engineering Research and Reports · pp. 19–23 · Published 4 Feb 2020
10.9734/jerr/2020/v10i217033Abstract
The paper offers an improvement for leadframe devices to mitigate the occurrence of package chipping rejection during package mechanical singulation. The discussion provides a specialized design of mold chase for mold encapsulation process, and an augmented mechanical cutting technique of package singulation. Furthermore, insights are shared to apprehend the manufacturability of the improved design and process during assembly manufacturing specifically on the critical process steps of mold encapsulation and package singulation.
Cited by 0
No indexed citations yet.
Related research
- Exploring the Optimization of UV Mutants of Streptomyces clavuligerus for Clavulanic Acid Production — shares topic coverage
- Optimizing Software Development Processes in Cloud Computing Environments Using Agile Methodologies and DevOps Practices — shares topic coverage
- The Effect of Knowledge Management Practices on Enhancing Construction Industry Performance in Nigeria — shares topic coverage
- Wire Shorting Elimination through Wirebond Process Optimization of Semiconductor Sensor Device — shares topic coverage
- Intensifying Cross-border Logistics Collaboration Opportunities Using a Virtual Logistics Center — shares topic coverage
Article metrics
Real usage data collected on this platform.
0
Page views
0
PDF downloads
0
Outbound clicks
0
Citations
Views by country
Approximate, from request IP at view time — not citizenship or institution. Countries with fewer than 5 views are grouped as "Other".
No views recorded yet.
Traffic sources
Referring site, by host.
No traffic recorded yet.
Views and downloads exclude known bots/crawlers. Citations combines this platform's own DOI-resolved index with each external source's own reported total — see Cited by above for individually listed citing works. Last refreshed 0 seconds ago.