Wirebond Process Improvement with Enhanced Stand-off Bias Wire Clamp and Top Plate
Jonathan C. Pulido, Frederick Ray I. Gomez, Edwin M. Graycochea Jr.
Journal of Engineering Research and Reports · pp. 1–4 · Published 13 Jan 2020
10.9734/jerr/2019/v9i317021Abstract
New design for a certain issue in semiconductor industry is another way to modify the standard configuration into specified limit or to make a possible solution of the problem. This paper presents a new modified design for wirebond top plate with a bias platform structure that will maintain a consistent second bond into a leadframe leads with half-etch configuration on quad-flat no-leads (QFN) packages especially in wirebond process. This paper used a side by side comparison to proof that the new design is better than the older design. With the new specialized wire clamp and top plate design, parts per million (PPM) level performances is improved by almost 90%.
Cited by 1
Wenjie Dai, Junfu Liu, Yunpeng Liu · 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) · 2022
Related research
- Elimination of Non-stick on Leads Defect through Re-designed WCTP — shares topic coverage
- Die Attach Process Analysis of Enhanced Stand-off Stopper on Tapeless Leadframe — shares topic coverage
- Die Attach Assembly Process Tool Advancement — shares topic coverage
Article metrics
Real usage data collected on this platform.
0
Page views
0
PDF downloads
0
Outbound clicks
1
Citations
Views by country
Approximate, from request IP at view time — not citizenship or institution. Countries with fewer than 5 views are grouped as "Other".
No views recorded yet.
Traffic sources
Referring site, by host.
No traffic recorded yet.
Views and downloads exclude known bots/crawlers. Citations combines this platform's own DOI-resolved index with each external source's own reported total — see Cited by above for individually listed citing works. Last refreshed 0 seconds ago.