The Study of the Effect of Surfactants on Copper Codeposition with SiC Nano Particulate from Deep Eutectic Solvent Ionic Liquids (Ethaline)

Abstract

Here we investigate the electrolytic deposition of copper and copper nano composites in the absence and the presence of two types of surfactants: cationic which is sodium dodecyl sulphate (SDS)  and the other type is cetyl  trimethyl ammonium bromide (CTAB) from a solution of the metal chloride salt in ethylene glycol–choline chloride based eutectics. The SEM images and EDAX analysis allow in situ quantification or particulate inclusion. It is quite interesting to perceive that the composition of composite material was strongly dependent on the amount of species suspended in solution. Again the data here has revealed that the majority of material was dragged onto the surface rather than settling on to it. The distribution of the composite material was found to be even throughout the coating. This technology is important because it facilitates deposition of bright copper coatings without co-ligands such as cyanide which is not friendly environment.