Glue Voids Reduction on QFN Device through Material and Process Improvement
Edwin M. Graycochea Jr., Endalicio D. Manalo, Rennier S. Rodriguez, Frederick Ray I. Gomez
Journal of Engineering Research and Reports · pp. 15–19 · Published 25 Feb 2021
10.9734/jerr/2021/v20i317275Abstract
The paper is focused on the glue voids reduction on critical semiconductor quad-flat no-leads (QFN) device processed on a stencil printing type of die attach machine. Process optimization through material preparation improvement was done to mitigate the silver lumps of the sintering glue which is a main contributor on the voids occurrence. Eventually, the glue voids were reduced to less than the allowed 5% limit. For future works, the learnings and configuration could be used on devices with similar requirement.
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