New devices and new technologies in semiconductor industry are getting more complex in terms of package layout, direct materials, and process capability. With the package design complexity, several issues are encountered during the development, and in turn affecting the overall...
Open access
Research Article10.9734/jerr/2020/v11i217059
Bangladesh is facing a tremendous energy crisis and the economic development of this country was jeopardized due to the lack of energy resources. Due to the progression of technology, the depletion of power is rising continuously. Adequate and consistent source of electricity is...
Open access
Research Article10.9734/jerr/2020/v11i217055
An alternative design of Quad-Flat No-lead (QFN) leadframe capable with three or more arrays of lead is discussed and presented on this paper. The leadframe design is integrated with connecting bars that can be routed and bonded with wires to decrease the wire span and create a m...
Open access
Research Article10.9734/jerr/2020/v11i217056
The paper focused in addressing wire-related assembly issues due to tight clearances in the semiconductor package design. Package design characterization was done considering the assembly design rules and the advanced rules, resulting to the integration of an interposer in the pa...
Open access
Research Article10.9734/jerr/2020/v11i217054
Aims: Reliability assessment of power generation system may be performed with the concept of system adequacy, security or both. Grid being a major component in the power distribution chain is seen to have some influence on the state of the generation system reliability because of...
Open access
Research Article10.9734/jerr/2020/v11i117053
Aim: The study aimed at designing a wastewater treatment method for removal of (Biological Oxygen Demand) BOD5 using Sequencing batch reactor (SBR). Study Design: SBR functions as a fill-and-draw type of activated sludge system involving a single complete-mix reactor where all st...
Open access
Research Article10.9734/jerr/2020/v11i117050
Improvement on the process and design is often a reliable way to resolve a problem especially in semiconductor industry. This paper presents a leadframe or semiconductor carrier merged with a stand-off design structure that will maintain a consistent bond line thickness (BLT) cri...
Open access
Research Article10.9734/jerr/2020/v11i117051
The study tested the performance of a batch-type recirculating laboratory scale bio-tower for the treatment of municipal wastewater. Performance tests were done with a HACH DR-1900 spectrophotometer include chemical oxygen demand, total phosphorus and nitrogen ammonia. This study...
Open access
Research Article10.9734/jerr/2020/v11i117048
The drive for thinner package architecture is already becoming a necessity. There were a need of thinner Integrated Circuit or IC in order to fit in to thinner applications like mobile phones. One of the major semiconductor process that enables miniaturization was wafer back grin...
Open access
Research Article10.9734/jerr/2020/v11i117049
This research work was carried out to provide local farmers with on-farm solar dryers to minimize post-harvest losses of vegetables. Two dryers (Mixed mode and Indirect mode on-farm solar dryers) were constructed using locally available materials. The dryers basically consist of...
Open access
Research Article10.9734/jerr/2020/v10i417046