The absent of reliable production controls for Die Attach Film (DAF) voids detection allowed defect escapee for Ball Grid Array (BGA) devices using non-conductive film material leading to gross assembly rejection and customer complaints. This paper presents the evaluation of pres...
Open access
Research Article10.9734/jerr/2020/v10i417047
Wafer Thinning as a major semiconductor process steps to attain miniaturization of Integrated Circuit or IC. Wafer back grinding up to 70 µm thickness is considered critical due to its fragility. The paper will discuss the definition and establishment of critical equipment check...
Open access
Research Article10.9734/jerr/2020/v10i417045
Water quality assessment is an important part of environmental quality management especially in groundwater resources located close to sources of contamination. This study involved the assessment of groundwater quality for hand dug wells at locations with proximity to pit latrine...
Open access
Research Article10.9734/jerr/2020/v10i417044
The current manuscript aimed to study a differential active balun circuit in terms of the small-signal analysis, implemented in a standard 90-nm complementary metal-oxide semiconductor (CMOS) technology. Small-signal or alternating current (AC) response or frequency response of t...
Open access
Research Article10.9734/jerr/2020/v10i417043
Poultry industry’s development in the past two decades and the need for increased animal protein sources in the hot regions of the world, require the need to develop housing system that is thermally controlled for optimal production. The research was carried out at Federal Univer...
Open access
Research Article10.9734/jerr/2020/v10i317042
The subgrades of three different rural roads alignment were investigated with the aim to determine their geotechnical properties. The three roads are on two different geologic terrains. Two of the roads, the 18 km Yahe-Waniye-Wanakom road and the 6 km Okpoma-Okuku road are on Cre...
Open access
Research Article10.9734/jerr/2020/v10i317041
In every new technology developed and introduced to the manufacturing floor, particularly in the wafer preparation, entails problems that later induce defects affecting the wafer yield. This paper discusses the optimization of wafer preparation parameters, particularly the tensio...
Open access
Research Article10.9734/jerr/2020/v10i317040
Draft requirements of two animal – drawn (IAR) weeders operating on loam soil were determined in the study. The implements include a straddle row weeder and an emcot attached rotary weeder evaluated under the same soil conditions, using a pair of white Fulani breed of oxen. The a...
Open access
Research Article10.9734/jerr/2020/v10i317039
Aims: To model tomato water productivity under deficit sub – surface drip irrigation and grass mulch densities using Aquacrop model. Study Design: The study was factorial experimental with twelve treatments. Place and Duration of Study: Tatton Agriculture Park, Egerton University...
Open access
Research Article10.9734/jerr/2020/v10i317038
The relentless advancement and trends on thinner packages have become the focus in the semiconductor manufacturing industry. The requirement of thinner packages also demands a thinner vertical structure of the semiconductor electronic design. As a major contributor on the vertica...
Open access
Research Article10.9734/jerr/2020/v10i217037