Modified Sidewall Design of QFN Package
Frederick Ray I. Gomez, Rennier S. Rodriguez
Journal of Engineering Research and Reports · pp. 19–23 · Published 4 Feb 2020
10.9734/jerr/2020/v10i217033Abstract
The paper offers an improvement for leadframe devices to mitigate the occurrence of package chipping rejection during package mechanical singulation. The discussion provides a specialized design of mold chase for mold encapsulation process, and an augmented mechanical cutting technique of package singulation. Furthermore, insights are shared to apprehend the manufacturability of the improved design and process during assembly manufacturing specifically on the critical process steps of mold encapsulation and package singulation.
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