Elimination of Crumpled Leadframe Defect through Machine Sensor Enhancement
Jonathan C. Pulido, Edwin M. Graycochea Jr., Frederick Ray I. Gomez
Journal of Engineering Research and Reports · pp. 16–19 · Published 28 Nov 2020
10.9734/jerr/2020/v19i217226Abstract
The paper focused on the improvement done in quad-flat no-leads (QFN) leadframe package assembly to address the quantity of rejection of crumpled leadframe during handling at wirebond process station. Overload sensor at the output magazine handler was found out to be defective, hence a new sensor was installed. With the improvement done, crumpled leadframe strip occurrence was ultimately eliminated.
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