Non-stick on Pad Defect Reduction through Clamp and Insert Design Augmentation
Antonio Sumagpang Jr., Rennier Rodriguez, Frederick Ray Gomez
Journal of Engineering Research and Reports · pp. 37–45 · Published 4 May 2020
10.9734/jerr/2020/v12i217078Abstract
With new and continuous technology development and breakthroughs, few to several challenges in semiconductor assembly manufacturing are inevitable. One critical assembly process often affected with these technology trends and changes is the wirebond process. In due course, this paper focused on the elimination of non-stick on pad (NSOP) assembly defect at the wirebond process. Fishbone analysis and why-why analysis were done to comprehensively investigate the root-cause and eventually address the problem. High NSOP rejection rate was identified to be attributed to clamp and insert design, and was verified through series of analysis, design of experiment (DOE) and validation runs. Results revealed that by using the modified clamp and insert design with more holes would address NSOP rejection with around 90% defect reduction.
Cited by 7
Payam Maleki, A. Akhavan‐Safar, E. Marques · Engineering Failure Analysis · 2026
Jonathan C. Pulido, R. Rodriguez, F. Gomez · 2021
F. Gomez, Alyssa Grace S. Gablan, A. Moreno · 2021
A. Moreno, E. Graycochea, F. Gomez · 2020
E. Graycochea, R. Rodriguez, F. Gomez · 2020
R. Rodriguez, F. Gomez, Jonathan C. Pulido · 2020
Raymond Albert A. Narvadez, F. Gomez, A. Moreno · 2021
Related research
- Challenges and Resolution for Copper Wirebonding on Tapeless Leadframe Chip-on-Lead Technology — shares topic coverage
- Wirebond Solution of Semiconductor IC Package through Modeling and Simulation — shares topic coverage
- Specialized Wirebond Process Configuration on Advanced Multi-Die Package — shares topic coverage
- Metallized Semiconductor Die for Long Wire Interconnect — shares topic coverage
- Addressing the Broken Wire Issue during the Assembly Manufacturing of QFN Leadframe Device — shares topic coverage
Article metrics
Real usage data collected on this platform.
0
Page views
0
PDF downloads
0
Outbound clicks
7
Citations
Views by country
Approximate, from request IP at view time — not citizenship or institution. Countries with fewer than 5 views are grouped as "Other".
No views recorded yet.
Traffic sources
Referring site, by host.
No traffic recorded yet.
Views and downloads exclude known bots/crawlers. Citations combines this platform's own DOI-resolved index with each external source's own reported total — see Cited by above for individually listed citing works. Last refreshed 0 seconds ago.