Effect of Backgrinding Tape Lamination on Die Alignment

Abstract

The continuing growth and development on semiconductor package miniaturization have become a particular interest and focus semiconductor industry. The importance of thinner packages also demands a thinner vertical structure of the integrated circuit (IC) design with silicon die or the wafer playing essential role in package thinning. As the wafer goes thinner, problems may occur in the wafer preparation or pre-assembly. With the introduction of new wafer preparation technologies such as dicing before grinding and laser die attach film (DAF) cut, technical challenges were inevitable. The paper focused on the effect of backgrinding tape lamination on die alignment. Tensionless lamination helped eliminate the horizontal pressure applied into the tape thus mitigating the die mis-alignment problem.  For future works, the configuration could be applied on wafers with similar technology and/or application.