Skip to content
Research Article Open access CC BY 4.0

Critical Insights in the Application of Convection and Pressure Curing in Eliminating DAF Voids

Bryan Christian S. Bacquian, Rennier Rodriguez, Edwin M. Graycochea

Journal of Engineering Research and Reports · pp. 36–42 · Published 5 Mar 2020

10.9734/jerr/2020/v10i417047

Abstract

The absent of reliable production controls for Die Attach Film (DAF) voids detection allowed defect escapee for Ball Grid Array (BGA) devices using non-conductive film material leading to gross assembly rejection and customer complaints. This paper presents the evaluation of pressure curing as an alternative to the convection curing in die attach process with additional capability to eliminate the DAF voids on non-conductive films. Through Analysis of Variance (ANOVA) analysis, green peeling test, Scanning Acoustic Microscope (SAM), cross section analysis and reliability test performed between samples arrives to the conclusion that pressure oven has a significant impact in die shear strength improvement and DAF voids elimination with positive response in reliability requirement. The result of the study improves the assembly flow and production control of BGA devices through the transition of convection to pressure curing technology.

BGA convection curing pressure oven DAF voids process improvement.

Cited by 0

No indexed citations yet.

Article metrics

Real usage data collected on this platform.

0

Page views

0

PDF downloads

0

Outbound clicks

0

Citations

Views by country

Approximate, from request IP at view time — not citizenship or institution. Countries with fewer than 5 views are grouped as "Other".

No views recorded yet.

Traffic sources

Referring site, by host.

No traffic recorded yet.

Views and downloads exclude known bots/crawlers. Citations combines this platform's own DOI-resolved index with each external source's own reported total — see Cited by above for individually listed citing works. Last refreshed 0 seconds ago.