Epoxy Fillet Height Study of Tapeless QFN Leadframe Package on Different Diebonders
E. Graycochea Jr., R. Rodriguez, F. R. Gomez
Journal of Engineering Research and Reports · pp. 18–21 · Published 28 May 2021
10.9734/jerr/2021/v20i817353Abstract
The paper focused on the evaluation of quad-flat no-leads (QFN) device in tapeless leadframe technology on different diebonder platforms to achieve an acceptable fillet height performance. The study was narrowed down into two main machines with the objective of attaining a fillet height of less than 75 % for small die. Eventually, the fillet height requirement was achieved by both diebonder platforms, hence, these machines could be used for future works on devices with similar requirement.
Cited by 0
No indexed citations yet.
Related research
- Package and Process Design Augmentation of QFN Leadframe Device — shares topic coverage
- Incorporating Package Grinding Process for QFN Thin Device Manufacturing — shares topic coverage
- Modified Sidewall Design of QFN Package — shares topic coverage
- Implementation of Pads Re-layout for QFN Multi-row Breakthrough — shares topic coverage
- Metallized Semiconductor Die for Long Wire Interconnect — shares topic coverage
Article metrics
Real usage data collected on this platform.
0
Page views
0
PDF downloads
0
Outbound clicks
0
Citations
Views by country
Approximate, from request IP at view time — not citizenship or institution. Countries with fewer than 5 views are grouped as "Other".
No views recorded yet.
Traffic sources
Referring site, by host.
No traffic recorded yet.
Views and downloads exclude known bots/crawlers. Citations combines this platform's own DOI-resolved index with each external source's own reported total — see Cited by above for individually listed citing works. Last refreshed 0 seconds ago.