Die Attach Process Analysis of Enhanced Stand-off Stopper on Tapeless Leadframe
E. Graycochea Jr., F. Gomez, R. Rodriguez, B. Bacquian
Journal of Engineering Research and Reports · pp. 22–26 · Published 13 Mar 2020
10.9734/jerr/2020/v11i117051Abstract
Improvement on the process and design is often a reliable way to resolve a problem especially in semiconductor industry. This paper presents a leadframe or semiconductor carrier merged with a stand-off design structure that will maintain a consistent bond line thickness (BLT) criteria for quad-flat no-leads (QFN) packages. Through package and process conceptualization, the stand-off design located on the leadframe underneath the silicon die corners would result to a steady and consistent BLT during die attach process. With the improved design, die tilt occurrence in die attach process would be mitigated.
Cited by 2
A. Sumagpang, F. Gomez, E. Graycochea · 2020
R. Rodriguez, E. Graycochea, Rammil A. Seguido · Journal of Engineering Research and Reports · 2020
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