A Study of Die Shear Test Performance on Different Diebond Machine Platforms
B. C. Bacquian, R. Rodriguez, N. Gomez, E. Graycochea Jr., F. R. Gomez
Journal of Engineering Research and Reports · pp. 19–23 · Published 31 Aug 2020
10.9734/jerr/2020/v16i317169Abstract
The paper focused on the evaluation of quad-flat no-leads single-row (QFN-sr) leadframe package for die shear test performance on different diebond machine platforms. Die shear test determines the adhesion strength on the interface between the silicon die and the die attach glue to the diepad of the leadframe device. Moreover, the test is critically monitored as failed response may lead to die lift or delamination. Statistical results showed the two diebond machines achieving die shear test performance above the specification, with Machine Y having significant improvement over its counterpart. Future works could utilize any of the two diebond machines platforms as far as die shear test performance is concerned. For devices with critical requirement, Machine Y is recommended for its higher die shear test performance capability.
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